Improved climate control inside electronic equipment enclosures based on a modelling approach

The aim of this project is to build a modelling approach based on empirical data for electronic enclosure design for improving climatic reliability of electronic devices.

Electronic control systems are used in all sorts of modern technological devices be it outside or indoors. Uncontrolled local climate inside the enclosures for these systems cause several humidity related failures on the Printed Circuit Board Assemblies (PCBAs) placed inside. Moreover, the designs of the enclosure for these systems are often based on experience gained over the years in the producing companies, rather than systematic, scientific knowledge. The main bottle neck for the industries to brake this trend and develop a more knowledge based design is the lack of dedicated modelling tools, which support the search for optimal designs and humidity control solutions. Employment of such solutions requires a detailed parametric investigation of the influencing factors followed by deducing numerical models. Hence, the aim of this project is to build up the necessary empirical and theoretical modelling base on which further development is possible.

PhD Projects under this programme:

1. Parametric study of interior climate in electronic device enclosures and corrosion reliability, PhD student: Helen Conseil

2. Developing semi-empirical models for predicting climate inside electronic device enclosures, PhD student: Zygimantas Staliulionis

Project partner:

Jesper Hattel, MPP, DTU-MEK

Associated industrial partners:

Danfoss A/S, Denmark

Grundfos A/S, Denmark

Vestas Windsystems A/S, Denmark

This project is funded by The Danish council for independent research, Technology and Production (FTP).